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Articles & Papers

The following documents are in Adobe Acrobat PDF format. We also have archived articles and papers available.

Surface Mount Technology

Jetting Dispensing of Fluxes for Flip Chip Attachment and Measurement Methods for Ensuring Consistent Flux Coatings - S. Adamson, S. Heveron-Smith (Lumetrics) (IMAPS, Austin TX, June 2004) (PDF 258 KB)

Jetting Technology: A Way of the Future in Dispensing - H. Quinones, A. Babiarz, L. Fang (EMAP, Taiwan, October 2002) (PDF 170 KB)

Jetting Technology for Microelectronics - H. Quinones, A. Babiarz, L. Fang (IMAPS Nordic, Stockholm, Sweden September 2002) (PDF 197 KB)

Fluid Jetting for Next Generation Packages - H. Quinones, A. Babiarz, C. Deck (Pac Tech, Berlin, April 2002) (PDF 163 KB)

Practical Applications of Process Control in Conformal Coating - M. A. Reighard (Apex 2002, San Diego, CA January 2002) (PDF 798 KB)

Advantages of Non-Contact Dispensing in SMT Assembly Processes - A. F. Piracci (SMTA/ATE, Chicago, IL, September 2000) (PDF 91 KB)

Practical Production Applications for Jetting Technology - A. F. Piracci (APEX 2000, Long Beach, CA, March 2000) (PDF 992 KB)

Conformal Coating Process Controls: The Manufacturing Engineer's Aid - M. A. Reighard, N. A. Barendt (Nepcon West, Anaheim, CA, March 2000) (PDF 25 KB)

Advancements in Conformal Coating Process Controls - M. A. Reighard (APEX 2000, Long Beach, CA, March 2000) (PDF 2,775 KB)

Chip Scale Packaging, Encapsulation and Underfill

Jet Dispensing Underfills for Stacked Die Applications - S. Adamason (ATE 2004) (PDF 365 KB)

Board Design for Flip Chips and Chip-Scale Package Underfill - S. Adamson & T. Adams (Electronics Bulletin Hong Kong, Vol. 6, 2003) (PDF 658 KB)

Medical Device Assembly using Jet Dispensing for Underfill Applications - T. Woods & S. Adamson (SMTA, May 2004) (PDF 217 KB)

Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces - S. Adamson (APEX 2004, Anaheim, CA) (PDF 230 KB)

Fluid Dispensing Capabilities for Assembly of MEMs - Alan Lewis, Steve Adamson, Lars M. Nielsen, Lisa Ryan (MEMS Sensor Packaging, Delta Denmark, March 2003 ) (PDF 190 KB)

Encapsulation Technology for 3D Stacked Packages - H. Quinones, A. Babiarz, L. Fang (ICEP/Microelectronics Tokyo, Japan April 2002) (PDF 210 KB)

Flip Chip, CSP and WLP Technologies: A Reliability Perspective - H. Quinones, A. Babiarz (Pac Tech, Germany, September 2001) (PDF 176KB)

Evaluation of Printed Circuit Board layout for Chip Scale Packages that Require Underfill and the Effect of Adjacent Passive Components - S. J. Adamson, J. J. Klocke, L. Nielsen (Pori Engineering Conference, Pori, Finland, September 2001) (PDF 136 KB)

Underfill Processes for Large-Small Flip Chip - A. Babiarz, H. Quinones, B. Ciardella (Pan Pacific, Kauai, HI, February 2001) (PDF 176 KB)

Advances in Fast Underfill of Flip Chips - A. Babiarz, H. Quinones (ICEP/Microelectronics, Tokyo, Japan, February 2001) (PDF 200 KB)

Design Considerations for High-Speed Underfill of CSP and Flip Chip Packages S. J. Adamson, J. J. Klocke (APEX Conference 2001, San Diego, California, January 2001) (PDF 159 KB)

Chip Scale Packaging Reliability - H. Quinones, A. Babiarz (EMAP, Taipei, Taiwan, November 2000) (PDF 202 KB)

Encapsulation of Large, Densely Populated Die with Small Gap - H. Quinones, T. Ratledge, D. Padgett, B. Huey (IMAPS UK, London, UK January 2001) (PDF 49 KB)

General

Breadth of Dispensing Technologies Offers a Wide Variety of Conformal Coating Processing Capabilities - M. Szuch (IMAPS SoCal 2004) (PDF 431 KB)

Formulation Considerations for Automated Dispensing of Lead Free Solder Paste - A. Lewis (PDF 254 KB)

Jet Dispensing - A Paradigm Shift in Technology - S. Adamson (MEPTEC 2003) (PDF 220 KB)

Fluid Dispensing Processes for Next Generation Electronics - H. Quinones (Pan Pacific, Hawaii 2003) (PDF 196 KB)

Archived Articles & Papers

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